Products
Reel Smart incoming material Stations come in two models: Reel Smart Lite (IMS-100) and Reel Smart Pro (IMS-200).
PF606-EP305 joint enhanced solder paste (JEP) and solder joint encapsulation material (SJEM) flux SMEF-Z52 are epoxy-based solder materials for very fine pad size (70μm) soldering, especially for advanced display packaging and assembly.
T4AB58-HF360 and T4AB58-HF360D solder pastes are for low-temp. reflow soldering processes designed for printing and dispensing applications.
Desktop dispensing robot integrates different dispensing technologies: from time-pressure to volumetric dispensers to electropneumatic or piezoelectric jet dispensing.
BCcomponents SMDY1 surface-mount AC-line-rated ceramic disc safety capacitors offer Y1 rating of 500VAC and 1500VDC.
SMT 158N is a non-flow, low-temp., slow-cure, high-purity liquid epoxy underfill and capillary underfill encapsulant.
Press Releases
- Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth