Pyramax 98 solder reflow oven is now equipped with an integrated flux coating and wafer handling system for wafer bump reflow. The coating system can handle 200 or 300 mm wafers and is configured with an integrated robotic wafer handler.
At the oven's back-end, an automated unloading station completes the integrated wafer handling process.
Features forced impingement technology for temperature uniformity and an optional closed-loop convection control for constant heat transfer and cooling rates. Provides atmosphere purity below 5ppm and reportedly has the industry's lowest nitrogen consumption.
The user-friendly SlimKIC 2000 profiler and process development tool has been upgraded to accommodate new applications including rework, batch ovens, and high- temperature furnaces. The new applications are built directly into the standard software at no additional cost.
With the conversion to lead-free manufacturing and its narrow thermal process window, rework is more critical and requires better profiling tools. The new software, which claims to provide better control and documentation of the rework process, is on display at booth 5015 at the Assembly Technology Expo this week in Rosemont, IL.
AuL2220 stand-alone, fully automatic printer with auto unload eliminates substrate handling issues for high-volume, fine pitch production. May also eliminate the need for expensive bare-board and magazine loaders. Allows transport upstream automatically to the pick-and-place station. Can be unloaded manually.
Equipped with:
Has 20 x 23" print area; will accommodate both cast and welded tubular stencils.
Universal Instruments has expanded and enhanced the services element of its Optima Plus solution model and reduced the price of extended warranty products.
The productivity solution combines Optima equipment and software with the Plus services portfolio to minimize cost and maximize throughput, yield and profit.
The extended warranties provide parts and labor coverage for individual machines and are being offered at significantly reduced globalized prices.
The Permalex low profile holder reportedly shows significant reduction in paste sticking. Features enhanced geometry and reduced surface area for paste to stick during the printing process.
New design features a reference point, which ensures replacement blades are accurately aligned against a pin.
The client-server edition of AutoVue 18 is now available for versions 8 and 9 of Sun Solaris servers. Clients can access data using browsers for Windows, Mac and UNIX.
Provides native viewing, printing, markup and real-time collaboration support for engineering drawings, 2-D CAD, 3-D drawings, parts and assemblies, EDA/PCB layouts and schematics, and office documents.
New features include:
Digital Mockup (DMU)
* The ability to import and combine any number of native CAD files, regardless of file format, to create a virtual assembly
* The ability to combine native MCAD and EDA (3-D PCBs) in a digital mockup
* Precise part alignment and constraint definition
* Interference and clearance checking
* The ability to save state information
3-D/2-D MCAD
* 3-D BOM
* Support for PMI and GD&T data
* User-defined coordinate systems
* Shaded wire render mode
* Fill and measure section edges
* 2-D precise measurement and snapping
EDA/ECAD
* Test PCB layouts for design and manufacturability violations
* Cross-probe layouts, schematics and PCBs in 3-D space
* Filters to hide/show entities based on type
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