Circuits Assembly Online Magazine - Current

Products

National Physical Laboratory has developed a new instrument for measuring solder properties. The advent of lead-free alloys makes it imperative to obtain accurate material properties on volumes of materials under 1mm^3. Instruments must be able to measure and displace small distances, typically a few micrometers to a precision of 0.1µm, and to measure low forces.

NPL has developed a machine that achieves this capability. Measurements are now possible at typical stresses and strains found in solder joints, resulting in realistic fatigue and creep rates. These values are essential for accurate, statistically based life-time predictions of lead-free reliability.

For further information contact:

Dr.Chris Hunt: chris.hunt@npl.co.uk

Milos Dusek: milos.dusek@npl.co.uk

Cogiscan's feeder setup validation system is reportedly robust and flexible enough for use on all different machine types. The RFID Smart Feeder system can be retrofitted to an existing placement machine in the field. The customer's inventory of feeders can be converted into "Smart" feeders by attaching a low-cost RF tag to each feeder.

Key features:

- Enables closed-loop feeder and component setup validation

- Eliminates human errors and reduces changeover time

- Provides real-time material inventory and traceability

- Quick and easy retrofit on any machine type

- Proactively scans all feeder slots in real time.

Can be used in combination with Cogiscan software applications. Can be integrated with feeder set-up verification software from third-party suppliers to eliminate manual barcode scanning at the machine.

Cogiscan, cogiscan.com

2200 Series BenchMate vibration-free platforms are said to enhance the performance of atomic force microscopes, microhardness testers, profilometers, balances, audio components and other precision tabletop equipment. Available in three different models, each providing application-specific vibration control with low natural frequency.

Model 2210 features vertical vibration control and uses a passive-air design that can be operated with an optional hand pump if an air source is not available.

Model 2212 uses a self-leveling, active-air unit and is recommended for more regular use.

Model 2214 offers an enhanced, multistage horizontal isolation feature, recommended for applications where both vertical and horizontal vibrations are a problem. The self-leveling, active-air unit that must be connected to a compressor.

Four table sizes are available up to 24 x 36", with table capacities up to 450 lbs. Class 100 cleanroom compatible, with a Class 10 option. Come with or without mounting holes, which can be tapped on an English (¼-20 x 1") or metric (M6 x 25mm) grid.

Kinetic Systems Inc., www.kineticsystems.com

Electronic Device Support Suite (eDSS) is a Web-based software application for remote FlashCORE algorithm development. The development kit includes access to a database of new and existing device algorithms. It is designed for implementing new or derivative electronic devices on FlashCORE-based programming systems.

Enables development engineers to achieve first article build for product testing within minutes rather than weeks. Eliminates complex product verification logistics.

Prepares algorithm executables for debugging and release. Accepts algorithm source code files as an input which produce job card files for testing algorithms.

Backed by online documentation, training materials and videos. User and group administration screens provide developer, quality assurance and administrator process roles.

Data I/O Corp., www.dataio.com

Dow Corning SE 4451 thermally conductive encapsulant has a pre-qualified, turnkey dispensing process. The combined material-and-process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year.

Designed for the heat-management needs of electronic power devices, the encapsulant offers thermal conductivity of 3W/mK at 25°C and 32,000 cPs viscosity. The material's properties enable fast dispense and cure times.

Dow Corning worked with alliance member and dispensing equipment provider Liquid Control Corp. to develop a turnkey dispensing process for the new encapsulant.

The companies will discuss the product and process during a one-hour online seminar on thermal interface materials on Nov. 11, at 11 a.m. EST. Click for more info.

Version 7.3 of the Trilogy 5000 solution for PCB process preparation and assembly programming operations and the Enterprise 3000 DFM solution for manufacturability and physical design verification of CAD data is now available.

Enhancements to the assembly engineering platform include various feature extensions to the Line Balancing, Documentation Editor and Machine Shapes Manager modules. Siemens SMT machine models S20, S23, S25, HS50, F4 and F5 are now supported..

The updated design environment offers tighter integration to the Cadence Allegro, Mentor Graphics Boardstation and Zuken Board Designer PCB CAD systems. Other extensions to the input/output interfaces include ICT output format. Features BOM and AVL handling, parts library management and DFM with emphasis on Signal Quality Analysis.

Valor Computerized Systems, valor.com