High Speed Alignment software reportedly can increase speed of six-axis robots 70% and improve accuracy 50%.
3Di inline AOI system is for inspection of high-density printed circuit boards and boards with combinations of small and tall components.
EO-B-023 A to E series fluxes are identical to EO-FC-006 filling compound used in tubular solders.
Structalit 5705 removable edge bonder is formulated for bonding consumer electronics components.