Products
CSL1501RW ultra-compact side-emitting infrared LED is ideal for head-mounted displays, industrial headsets and VR/MR/AR (xR, virtual reality) gaming systems.
Free height computer-on-module (COM) connectors with 0.5mm centerline address vertical, parallel and board-to-board connections that require high-speed data transmission and different stacking heights.
MWS 2300 wave soldering system now has automatic nozzle height adjustment that does not influence cycle time.
SECS/GEM communication package for MPM Edison printer is a semiconductor market communication standard that provides a common interface between manufacturing equipment.
10 650V silicon carbide (SiC) Schottky diodes feature merged PIN Schottky (MPS) design.
SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.
Press Releases
- Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth