Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.
Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.
With Microfactory, manufacturers can now deploy and operate automated assembly lines with fewer people.
Master Bond MasterSil 151S is a two-part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.
CX90MW waterproof USB 3.2 Gen 1 Type-C connector is for applications that require miniaturization with resistance to liquid, vibration and/or shock.
MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.