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EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.

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CX90B series top-mount USB 2.0 Type-C connector has 16 contacts. Is reportedly ideal for applications susceptible to high-vibration and drop impacts, including control systems, drones, medical devices, smart meters, point-of-sale equipment, imaging equipment and other small portable devices.

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EP21ARLV two-part epoxy may be used as adhesive, sealant, coating or encapsulant. Is capable of withstanding prolonged exposure to 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate.

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MKP1848H series of automotive-grade DC-Link metallized polypropylene film capacitors are optimized for high humidity environments.

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WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.

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RCX320/340 software plugin is for Asyril Asycube intelligent parts feeder.

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