Products
Master Bond EP17HTS-DA is a one-component, no-mix, electrically conductive die-attach epoxy.
R&S RTO-/RTP-K133 advanced jitter analysis option for R&S RTO and R&S RTP oscilloscopes helps development engineers gain insight into individual jitter components of transmission interface.
TMBS Trench MOS Barrier Schottky rectifiers are now with 16 2A and 3A devices in eSMP series low-profile SMP package.
YRM20 chipshooter uses two head types: a high-speed, multi-purpose rotary head that, when combined with the high-speed feeder, delivers performance under optimal conditions of 115,000cph, as well as a one-head solution via inline (HM) head.
Design and test workflow reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems.
Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.
Press Releases
- Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth