Shenmao Debuts PF925 SAC+ Solder
Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.
Eenhances solder joint integrity through dispersion strengthening, solid solution strengthening, and inhibition of brittle intermetallic compound (IMC) growth for long-term durability. Reportedly minimizes Kirkendall void formation.
Has a pasty range of TL- TS = 2°C for thermal stress resistance and joint separation prevention. composition allows solder joints to solidify more uniformly, reducing stress and improving overall reliability. Is halogen-free (ROL0) with full RoHS, RoHS 2.0, and REACH certification. Flux minimizes voiding in BGAs, QFNs, and MOS components. Developed with Panasonic’s patented Sn-Ag-Cu-In-Bi alloy.
Shenmao
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