Somerset, NJ – March 27th, 2018 – Alpha Assembly Solutions, a leading global supplier of innovative electronic assembly materials, is participating in the IDTechEx Show taking place on April 11th-12th in Berlin, Germany. Alpha will be exhibiting jointly with MacDermid Autotype at Booth #J15.

Alpha will introduce a mutually compatible platform of Products that include: Silver Inks, Carbon Inks and Dielectric Inks. Additionally, for Flex-PCB assembly applications, the ALPHA® product portfolio includes Low Temperature Solder Pastes and Electronic Adhesives that meet performance and reliability requirements.

“Currently, the key challenge in Printed Electronics is to have the right balance of compatibility with a variety of substrates along with robust and reliable overall performance. Alpha’s inks combine excellent printability with good adhesion, and have best-in-class electrical conductivity and mechanical robustness,” said Rahul Raut, Director of Strategy & Technology Acquisition for Alpha Assembly Solutions.

“On the other hand for Flexible PCB assemblies, warpage remains a major issue. Alpha’s novel low temperature solder pastes mitigate F-PCB warpage and offer a robust platform for low temperature processing,” said Dr. Bawa Singh, EVP of Technology and Corporate Development for Alpha Assembly Solutions.

Alpha’s sister company, MacDermid Autotype, will also be exhibiting within the same space, located at Booth #J15.  They are a world leading global supplier of high quality precision coated films and materials for use in Electronics, Automotive and Printing industries.

Alpha’s exhibit will also include the ALPHA® Graphene Portfolio consisting of inks, pastes and foils, in addition to ALPHA® Products for Flexible, Formable and Printed Electronics.

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