MacDermid Alpha Assembly Division to Present Paper on SMT Miniaturization and Exhibit at SMTA Rocky Mountain Expo & Tech Forum
(Waterbury, CT USA) – January 17, 2019 – The Assembly division of MacDermid Alpha Electronics Solutions, the world leader in the production of electronic soldering and bonding materials, will be delivering a technical presentation and exhibiting at the Rocky Mountain Expo & Tech Forum taking place at Mile High Stadium in Denver, Colorado on Thursday, February 21, 2019.
Jason Fullerton, Customer Technical Support Engineer, will be presenting The Continuing Miniaturization of SMT during the Technical Forum. His presentation will focus on how the demand for smaller, more powerful electronics is influencing both materials and assembly technology, and the impact these devices are having on traditional SMT processes. “Ultra-fine pitch technology is an important part of miniaturization and its associated challenges,“ said Jason Fullerton. “Customers need to understand how these smaller, more powerful devices impact the traditional SMT processes, and what adjustments are required for process parameters and materials.“
In addition, MacDermid Alpha will be promoting its recently launched ALPHA® OM-358 ultra-low voiding paste. ALPHA® OM-358 provides excellent resistance to electrochemical migration on fine pitch components, making it ideal for high reliability applications, such as Automotive, Medical and Defense. “This paste was designed to provide ultra-low voiding performance“, said Robert Wallace, Regional Marketing Manager for the Americas. “Providing less than ten percent voiding on bottom terminated components, this paste is well suited to meet the demands of our customers who have high reliability requirements“.
For additional information, about MacDermid Alpha’s latest technologies and products for SMT Assembly Solutions, please visit us at the Expo and Tech Forum or vist us at alphaassembly.com.
