Carteret, NJ —Monday, February 04, 2019— On February 26th at 1:30 PM ET, Fujipoly will host a live webinar that reveals many of the advantages putty-type thermal interface materials offer compared to standard gap filler pads. Thermal interface material expert Christian Mainegra, will also host a live question and answer session immediately follow the 30-minute presentation.

Key topics will include stress strain comparisons of putties and standard gap fillers, advantages of putty over dispensable thermal interface materials, as well as putty handling and application suggestions.

Register for Free at https://www.fujipoly.com/usa/news/webinars.html

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