iNEMI’s New Packaging Technology Qualification Methodology project is evaluating methods currently used by the electronics manufacturing industry to qualify new packages and materials.

The project team conducted two industry surveys to assess current methodologies and define use conditions in order to identify potential gaps in common industry practices. A summary of their key findings, and recommendations about how identified gaps should be addressed, will be covered in a webinar on July 9. The webinar is free, but advance registration is required. Two sessions are scheduled:

Session 1 – Asia Pacific

Tuesday, July 9

9:00 a.m. JST (Japan)

8:00 a.m. CST (China)

Session 2 - The Americas / EMEA

Tuesday, July 9, 2019

8:00 a.m. EDT (US)

2:00 p.m. CST (Europe)

Contact Masahiro Tsuriya (m.tsuriya@inemi.org) for information.

Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center. pcbwest.com

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