San Diego — July 2019 — KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

KIC also will showcase the Reflow Process Inspection system, RPI i4.0, automatic profiling system with integrated network software for real-time data sharing, dashboard and traceability.

DO YOU HAVE ALL YOUR INSPECTION EQUIPMENT?  SPI, AOI, RPI?

MB Allen is a manager for KIC’s Applications & Sales in the Americas. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company’s product offerings. MB has worked in electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

For more information about KIC, visit www.kicthermal.com.

Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center. pcbwest.com

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