LPKF Introduces ProtoLaser U3 Laser
Published: 27 February 2012
by Staff
ProtoLaser U3 UV laser can cut or depanel nearly any substrate material; is for drilling, marking, depth engraving and surface etching of circuitry directly onto FR-4, ceramic or any other high-frequency RF substrate. The 15 µm beam spot permits etching surface structures down to as small as 1 mil.
LPKF Laser & Electronics, www.lpkfusa.com
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