BR750 rework station has high-resolution split-vision and is Pb-free. Contains processing controls for removal and placement of BGAs, CSPs, QFNs, PoPs, and other subminiature surface mount devices. Has independent and programmable top and bottom hot air, plus rapid on/off IR underheaters; reportedly eliminates thermal tension that can damage boards or components adjacent to those being processed. Contains eight different set points; exact thermal conditions can be produced for profiles containing heating rate, target temperature, dwell time and cooling. Profiles are shown in real time on an LCD display. SMDs are automatically pre-aligned and picked up from the component nest at their exact centers. An upward-looking camera verifies positioning at all four corners of each device, while split-vision optics and electronic zoom adjustment of up to 22x do the fine tuning. Handles PCBs up to 500mm x 550mm and component sizes from 1mm x 1mm to 60mm x 60mm.

Manncorp, www.manncorp.com

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