Martin Debuts Process Shuttle for Rework Systems
Eexpert 10.6 rework system now comes with the Process Shuttle to streamline flux and solder paste dipping or printing, and pre-positions small surface mountable devices for pickup. Installs on Auto-Vision-Placer (AVP) systems. Features include µSMD Tool, which presents small components with an easy-access fixture, improving processing time. Specific sizes are engineered for optimal pre-alignment. Dipping Tool permits solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste. Different depths are available to yield specific depositions. Printer Tool permits solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing stencils can be easily changed to minimize process setup. Transport slide holds various shuttle tools, which feed diverse components to the rework process in a controlled manner.
Retrofits to existing Martin systems that have automated vision placement. Does not require software programming.
Martin, a Finetech Co., www.martin-smt.de
