HANOVER, GERMANY – At IPC APEX Expo Viscom Inc. will showcase its latest innovations in high-resolution inspection technology. From March 18th-20th, 2025, at Booth No. 2820, in Anaheim, California, visitors will have the opportunity to explore Viscom’s innovative X-ray and AOI inspection solutions designed to meet the growing demands of precision-driven electronics manufacturing.

iX7059 PCB Inspection XL: Advanced 3D X-ray Inspection for Complex Assemblies

At the forefront of Viscom’s showcase is the iX7059 PCB Inspection XL, an advanced X-ray inspection system with high-resolution. Engineered for large and intricate assemblies, it delivers exceptional defect detection, making it an ideal solution for high-mix and high-reliability production environments. Equipped with powerful microfocus X-ray technology, dynamic 3D image acquisition methods and seamless handling, it ensures optimal throughput. The extended longboard option further enhances its capability, making it a perfect fit for inspecting large PCB assemblies. This solution is ideal for server boards, LEDs, semiconductors and 5G electronics.

Versatile X-ray Inspection with the X8011-III

The X8011-III Viscom system combines 2D and CT 3D X-ray imaging, offering unparalleled precision across a broad range of applications. Known for its flexibility and image clarity, this system is designed to support manufacturers in detecting even the most subtle defects in complex electronic components. With an intuitive and innovative interface, the system supports both manual and automated inspection – whether for components, assemblies in production, quality assurance or development. Its advanced capabilities contribute to cost optimization, process stability, and enhanced product quality.

Innovative AOI/SPI Solutions – the iS6052 Series

In addition, with Viscom’s iS6052 series visitors can look forward to new cost- effective 3D inline inspection systems, meeting demanding cycle time requirements and offering ideal system configuration with respect to costs without compromising on inspection speed. Viscom’s iS6052 series introduces another level of automatic optical inspection, integrating advanced 3D imaging for superior defect detection. Designed to support high-speed production while maintaining stringent quality standards, this platform is tailored for today’s dynamic manufacturing landscapes.

Pioneering Software and AI Developments

Attendees of the IPC APEX Expo can also discover Viscom’s smart AI solutions vAI, including AI-based verification, AI-supported image processing and inspection program generation. They can also discover the latest vVision 4.2 software. These innovations enhance image processing, accelerate verification workflows, and maximize inspection performance overall. Visitors can also explore Viscom’s vSPC DataVision – an advanced Statistical Process Control tool designed for real-time performance analysis and continuous process optimization.

Viscom’s Comprehensive Inspection Solutions for Evolving Industries:

Beyond these flagship systems, Viscom will highlight a diverse portfolio of inspection solutions for: 3D Solder Paste Inspection (SPI), Conformal Coating Inspection, Wire Bond Inspection and Battery Cell and Energy Storage applications.

Each solution delivers exceptional defect detection and high-resolution imaging, ensuring production reliability and process optimization across a variety of industries. Whether manufacturers require AOI, X-ray, or hybrid inspection systems, Viscom continues to set the standard in inspection excellence. Join Viscom Inc. at IPC APEX Expo 2025 to experience the latest inspection technologies shaping the future of electronics manufacturing. Visit Booth No. 2820 to explore solutions that redefine industry standards.

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