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SANTA CLARA, CA -- More than 400 industry insiders gathered here yesterday for Microsoft's first Global High Tech Summit, a forum that looked at challenges and trends facing high tech manufacturing.

In a joint effort to improve supplier collaboration, Microsoft and Intel announced proposals for the next-generation of open, interoperable business standards for small-to-medium enterprise supplier collaboration, based on the Office Open XML formats.

Under the management of the open standards body Ecma International, the Open XML document formats are now being finalized as a worldwide standard by leading tech companies including Intel. The document format standard offers flexible support for integration external XML information, which is critical to RosettaNet requirements.

Also announced was the establishment of a customer advisory board composed of companies representing various market segments, including Applied Materials, Flextronics, Juniper Networks, Nvidia, Xilinx and others.
Electronics Workbench will sponsor a free Webinar on enhanced schematic capture during PCB layout using specific software tools.

The one-hour online event takes place Oct. 3, at 9 and 3 EST.

Topics to be covered include the company's Ultiboard interface, advanced routing and placement, managing design constraints, exporting industry standard formats and more. To register, visit http://www.electronicsworkbench.com/news/pronews3b.html.
TAIPEI -- BenQ Corp.'s German handset unit is considering filing for insolvency after its board decided to halt funding to the division. BenQ's cellphone units in Brazil and elsewhere are also reviewing their financial positions, according to reports.

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WOODRIDGE, IL – Morey Corp. will build a state-of-the-art technical research and design facility next year near the EMS company's headquarters in Woodridge. The site will assist Morey’s telematics, controller, and display product lines.

Plans call for a 26,300-sq. ft., two-story facility to be located adjacent to the company’s headquarters.

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SAN JOSE – MEPTEC, the MicroElectronics Packaging and Test Engineering Council, will hold its annual packaging roadmaps symposium Nov. 16 in San Jose.

IC Packaging & Test Roadmaps: Device Trends Impact on Packaging & Test Technology and Supply Chain, the annual roadmap symposium, will overlay IC device trends with the associated current and future technology solutions for packaging and test and will also explore challenges associated with demands for full turnkey supply chain services.

For more information, visit www.meptec.org.

EL SEGUNDO, CA — The U.S. in 2006 is expected to maintain its lead in the worldwide electronics equipment design with the nation’s activities in this area driving the most semiconductor purchasing of any country, according to new data from iSuppli Corp. However, China’s rapid growth in electronic-design-generated semiconductor purchasing activity is continuing and the country is closing the gap, the research firm said.

“Design of electronic goods leads directly to equipment production, which in turn drives semiconductor purchasing. Companies that engage in design of electronic equipment, such as PCs, mobile phones and televisions, also are responsible for specifying the use of particular chips in the products being developed,” said Min-Sun Moon, OEM spend analyst for iSuppli. “Thus, these companies and the nations where they operate have a major influence on global semiconductor spending.”

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