CLINTON, NY – More than 40 technicians and applications engineers attended Indium Corp.’ s 4th Annual Global Technical Summit in September. Attendees from Asia, Europe, Mexico, and the U.S. learned about new products, current research, and breakthrough developments, and presented case studies.
The agenda included presentations by Dr. Claudius Ferger, manager of advanced plastic packaging at IBM’s Thomas J. Watson Research Center; Indium vice president of technology Dr. Ning-Cheng Lee and senior technologist Dr. Ronald C. Lasky.
FREMONT, CA – Scientific Technologies (STI) has completed its merger with a subsidiary of Japan-based Omron Corp. STI shareholders will receive $10.67 per share in cash as a result of the merger, and STI will cease to be a publicly traded company.
As part of the merger, Omron acquired STI’s safety products group, and STI’s automation products group was sold and becomes a standalone company. The total transaction values the equity of the company at approximately $110.8 million.
As part of the merger, Omron acquired STI’s safety products group, and STI’s automation products group was sold and becomes a standalone company. The total transaction values the equity of the company at approximately $110.8 million.
MILPITAS, CA – Flex circuit manufacturer Lenthor Engineering has updated technical details in its Flexible Circuit Design Guide. The new version is available at www.lenthor.com.
The guide is intended to provide a comprehensive understanding of the use, design and fabrication of flexible and rigid-flexible printed circuit boards.
The guide is intended to provide a comprehensive understanding of the use, design and fabrication of flexible and rigid-flexible printed circuit boards.
ALLEN, TX -- Sanmina-SCI has signed a deal to assemble certain components designed by Enablence Technologies and used in household optical
modems, the companies told a local paper. Financial terms were not disclosed.
SAN FRANCISCO -- A September poll of CIOs predicts IT budgets will grow
6.5% over the next 12 months, down slightly from 6.9% in June.
Optimism among CIOs at the biggest companies was higher than in the previous two quarters, suggesting seasonal strength among the biggest companies as the year ends, said Deutsche Bank, which cosponsors the poll.
Optimism among CIOs at the biggest companies was higher than in the previous two quarters, suggesting seasonal strength among the biggest companies as the year ends, said Deutsche Bank, which cosponsors the poll.
BANNOCKBURN, IL — Rigid PCB shipments by North American fabricators rose 8% in August
while bookings climbed 7.7% year-over-year, according to a monthly poll. Flex circuit shipments were up 27% and bookings were up 30.5% percent, IPC said.
The rigid board book-to-bill ratio rose 0.04 points to 1.06, and the flex circuit book-to-bill ratio was up 0.04 points to 1.05. The overall ratio was also 1.05, up 0.03 points. The ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period. A ratio of more than 1.0 suggests probable near-term growth.
Year to date, rigid PCB shipments are up 10.6%, and bookings are up 13.8%. Flex circuit shipments are up 4.5%, bookings are down 8.4%.
Combined shipments in August increased 9.3% from a year ago and bookings increased 9%. Year to date, combined shipments are up 10.2%, bookings are up 12.1%. Rigid PCBs make up an estimated 85% of the North American market, IPC said.
The data reflect sales, not production, IPC notes. For the month, 89% of the PCB shipments reported were produced in the U.S. or Canada. Furthermore, about 26% of the flex circuit sales comes from value-added services.
The rigid board book-to-bill ratio rose 0.04 points to 1.06, and the flex circuit book-to-bill ratio was up 0.04 points to 1.05. The overall ratio was also 1.05, up 0.03 points. The ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period. A ratio of more than 1.0 suggests probable near-term growth.
Year to date, rigid PCB shipments are up 10.6%, and bookings are up 13.8%. Flex circuit shipments are up 4.5%, bookings are down 8.4%.
Combined shipments in August increased 9.3% from a year ago and bookings increased 9%. Year to date, combined shipments are up 10.2%, bookings are up 12.1%. Rigid PCBs make up an estimated 85% of the North American market, IPC said.
The data reflect sales, not production, IPC notes. For the month, 89% of the PCB shipments reported were produced in the U.S. or Canada. Furthermore, about 26% of the flex circuit sales comes from value-added services.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri