BANBURY, UK - General Hybrid UK, a contract electronics manufacturer, has been purchased by a group of its executives and will change its name to Copernica.

The new management group is led by former general manager Alan Longland. Most of the staff will be retained, according to news reports.

The company designs and manufactures thick-film hybrid circuits, PCB assemblies and high-voltage resistors. It also distributes some components.

It was formerly part of the HiDensity Group, a Swiss company.

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CANNES, France - Flextronics and Microsoft Corp. have codeveloped a GSM/GPRS mobile phone platform based on Windows Mobile software. The companies announced the new software today at the 16th annual 3GSM World Congress.

Called Peabody, the new platform offers OEMs access to more than 18,000 applications for product line customization. Applications include messaging, music, video, pictures and gaming.

"As mobile phones become increasingly customized consumer products, OEMs are under pressure to produce low-cost, feature-rich phones that address the demands of this growing market," said Tom Deitrich, vice president of ODM Products, Flextronics.

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HOLDEN, MA -A pair of longtime New England printed circuit board makers have merged, the companies announced.

EPEC has purchased the primary assets of ECC, including the customer accounts. Both companies make quickturn prototype PCBs.
 
In a press release, ECC president and CEO Paul Johnson said, "I am confident this opportunity will enhance our customer support, from new product introduction through volume production."

EPEC was founded in 1952; ECC in the early 1950s.

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HERNDON, VA - A leading electronics manufacturing consortium will release the its latest technology roadmap next week during an industry conference in Anaheim, CA.

iNEMI is also planning several gap analysis meetings to discuss findings and prioritize needs for system-in-package, board assembly and substrates, environmentally conscious electronics, and product lifecycle information management, the trade group said today.

Jim McElroy, executive director and CEO of iNEMI, will discuss the roadmap in a Feb. 24 keynote.

iNEMI says the roadmap is its most extensive to date, with 26 chapters that cover seven product sectors and 19 technology, infrastructure and business practice areas. New are chapters on SiP; medical products; networking, datacom and telecom products; and sensors. The roadmap will be available March 1.

The roadmap addresses shifts and needs in technology, infrastructure and business practices.

iNEMI says the new version is significant for its global development. Some 470 individuals from 220 organizations in 11 countries worked on the roadmap.

"Globalization demands that we think beyond continental boundaries as we consider future technology deployment and research needs," says McElroy. "It's important that we focus globally as we identify the gaps that could potentially impede progress of the electronics manufacturing industry worldwide."

The iNEMI roadmap compares technology trends with anticipated product needs, and identifies "gaps" and "showstoppers" that are potential threats to industry advancements. Gap analysis meetings, such as the ones scheduled at APEX, stimulate in-depth discussions among individuals from various segments of the industry to develop action plans that will address industry needs and help close the gaps identified by the roadmapping process. Four of the iNEMI Technology Integration Groups (TIGs) will hold gap meetings at APEX: Board Assembly and Substrates (jointly), Environmentally Conscious Electronics, Product Lifecycle Information Management (PLIM) and the newly formed System-in-Package (SiP) TIG.

"These gap analysis meetings are a very important part of our process," said McElroy. "Our biennial roadmaps identify industry needs, then we follow up with in-depth gap discussions to identify areas where we can collaboratively address needs and goals through R&D, innovation, deployment and standards development."

During the week, other iNEMI meetings include a report on a three-year project to develop lead-free assembly and rework processes for large and thick boards.