BANNOCKBURN, IL – The US Environmental Protection Agency unofficially released a final version of the 2011 proposed revisions to the Definition of Solid Waste rule.
TAIPEI – Hon Hai (Foxconn) plans to close operations at a mobile phone facility in southern India as a result of customer changes, according to reports.
DORNSTADT, GERMANY – The 8th ASYS Group Technology Days brought some 400 customers and partner companies together to observe a full working SMT line and listen to several live electronics assembly seminars.
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
EARTH CITY, MO -- Raven Industries will close its facility here by next fall and lay off 58 workers.
FRANKLIN, MA – Pat O’Brien will take over as vice president and general manager of Speedline Technologies on Jan. 1. O’Brien is currently vice president and general manager of ITW Thermal Processing.
Press Releases
- Altus Helps to Enhance Nexperia's Production Capabilities with Essemtec Fox MFC
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Long Island Expo & Tech Forum
- BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America
- High-Performance TIMs: Beyond Traditional TIM Materials