SIEVI, FINLAND – As a result of a favorable third quarter, Scanfil is revising its estimates for 2015, now expecting $403 million to $431 million in revenues. The firm’s previous estimate was $392.8 million to $410 million.
BANNOCKBURN, IL – New microvia requirements are at the heart of the latest IPC standard for bare board qualification and performance.
OYSTER, BAY, NY – After 2020, 4G will be the leading connection technology for OEM telematics revenues, says ABI Research.
ATLANTA – Last week’s PCB West show attendance rose 10.4% year-over-year, to more than 1,900 attendees, UP Media Group announced today.
DUSSELDORF, GERMANY – Henkel Adhesive Technologies and molding equipment manufacturer LPMS USA have formed a partnership for building molded assemblies.
NEVADA CITY, CA – The worldwide electronics assembly market has nearly quadrupled in size in the last 20 years, says New Venture Research, reaching some $1.4 trillion in 2015 in terms of cost of goods sold.
Press Releases
- Strong signal for the industry: productronica 2025 drives positive industry trend
- Sharpen Your ESD Skills: CE3S Announces Desco’s First ANSI/ESD S20.20 Training Series for 2026
- Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
- Altus Partners with Sellectronics to Enhance Manufacturing Capabilities with PVA Delta 8 System