ALEXANDRIA, VA -- A quartet of Samsung engineers have been issued a US patent for a molded underfill flip chip package in which a semiconductor chip is mounted on a printed circuit board through bumps. The invention will prevent or reduce warpage and voids in the semiconductor package so as to increase reliability of the semiconductor package, the inventors said in the patent filing.

NEW YORK – An undercover investigation by a prominent human rights group has found labor rights violations ranging from unpaid and excessive overtime to verbal and physical abuse at a China-based supplier to Samsung. The report, issued this week by China Labor Watch, details such violations as $84,000 of monthly unpaid overtime wages, up to 148 hours of overtime per month, intense rates of work that have workers assembling one cellphone case every four seconds, regular verbal abuse by management, forcing workers to work barefoot, fines imposed on workers, and insufficient safety training and safety measures.

WASHINGTON – Global semiconductor sales were $27.06 billion in October, up 7.2% year-over-year, and up 0.8% sequentially, says the Semiconductor Industry Association. October marked the eighth consecutive month of growth in sales and the industry’s first-ever month above $27 billion in sales, the firm says.

ATLANTA, GA – CIRCUITS ASSEMBLY today announced Lightspeed Manufacturing as its EMS Company of the Year for 2013. The distinction is bestowed annually on EMS companies that have demonstrated profitability and sustained excellence among their peers.