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Sliver card edge connectors are now SFF-TA-1002 compliant.

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Microbond SMT650 solder paste offers high surface resistance.

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TJC series thermal jumper chips enable designers to manage temperature rise in compact power electronic assemblies.

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EO-B-013 no-clean, alcohol-based fluxing agent has been developed for power electronics.

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HD-171 4-direction tilt unit makes side-viewing possible in any direction and is designed to achieve easy and repeatable 30° angling of a camera in four directions.

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00-6791 series RF wire-to-board coaxial IDC connectors are for industrial and automotive applications.

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