VP-9000 3D-SPI system is used in printed circuit board manufacturing process for production of electric devices.
3Xi-M200 3D-CT automated x-ray inspection system is designed to inspect and measure insulated gate bipolar transistor power modules.
Full 3-D ALD8720S inline AOI system delivers high-range, precise, shadow-free 3-D height measurement of solder joints and components, fast inspection, 100% board coverage, high detectability, low false call rate, auto-programming, debug-free powerful OCR, IPC-based defect judgement criteria and other features.
NexTeach Pro software for PSV7000 automated programming system reportedly reduces job setup time up to 4x and increases production throughput up to 24%.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing