Low-void solder columns have high temperature core and are structurally stronger and more reliable than ones with a higher incidence of voids.

LumenX v. 1.6 programmer reportedly delivers better download performance and establishes support for the latest generation of microcontroller (MCU) architectures.

Loctite Eccobond UF 1173 protective underfill material doesn’t contain any reportable REACH SVHCs, is not CMR classified and reportedly performs under high operating temperature environments.

Costimator 2019 cost estimating software supports estimating of hundreds of different manufacturing processes, including all forms of machining, fabrication, assembly, molding, castings, forgings and electronics.