BH (3.96mm pitch) and BK (5.08mm pitch) series high current board-to-board connectors are available in SMT configuration.
Master Bond EP17HTDA-1 one-component die-attach epoxy can also be used for bonding and sealing.
SPS-2000 solder paste mixer features high-speed mixing capabilities (approx. 1000rpm), resulting in shorter mixing times.
Pyramax convection reflow oven now comes with optional TrueFlat technology, which reportedly ends die tilt. Is designed for substrate thicknesses of 0.15 to 0.30mm.
Sarcon SPG-20A silicone is an easy-to-dispense, low-viscosity compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W.
Press Releases
- ASYS Group Technology Days 2024: A Record-Breaking Celebration of Innovation
- Bittele Electronics Expands High-Complexity, High-Reliability PCB Assembly Services for the AI Industry
- Absolute EMS Appoints Greg Beck as Director of Sales
- Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight December 11-13, 2024