Alpha OM-550 low temperature solder paste pairs with HRL1 alloy for assemblies with temperature-sensitive substrates, components and high-warpage chips. Reduces soldering temperature required for SAC alloys by 50°C, while reducing power consumption and carbon emissions.

ADS200 production soldering station features TD-200 Cool-Touch hand piece, with aluminum handle designed to stay cool during continuous production soldering.

Master Bond UV22DC80-10F is a single-component, nanosilica-filled thixotropic compound featuring a UV- and heat-curing mechanism.

UULA 3D line confocal scanner enables high-speed 3D imaging of surfaces that are difficult to measure.