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SMT 2017 (20.20) inline board cleaner uses patented rollers and a new proprietary adhesive to increase conductivity of the product without adding conductive particles.

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R360 forced convection reflow soldering oven features a new airflow concept said to reduce energy consumption, whereby air moves from the fan to the PCB, then through a baffle plate, filter and heat exchanger.

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Solder Fortification preforms are generally rectangle- or disk-shaped pieces of alloyed metal that do not contain any flux.

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HD-050 telescopic height adjustment table expands working distance with the C-12 and U10 high-performance video microscope inspection systems.

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DA 150 series materials die attach adhesives offer conductive and insulating options for a variety of applications.

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Kite line scan AOI offers first-article inspection as well as full traceability for faults.

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