Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.
New generation PF606-P140 Pb-free solder paste and PF606-P245 zero-halogen Pb-free solder paste have wide process windows, superior print and solderability to solve head on pillow issues and improve ICT testability.
New generation SMF-WB51 ultra-low residue liquid flux reportedly has superior spray uniformity, excellent soldering performance, and a wide process window for chip scale and fan-out wafer level -packaging.
Shenmao America
shenmao.com
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Mycronic feeder repair kit for Agilis Flex feeders includes precision-machined aluminum side cover plate and matching barcode.
CircuitShield is an anti-corrosion, waterproofing, and reliability-enhancement nanocoating technology that protects semiconductor devices, printed circuit boards and other electronic components.
Tabletop Shadow Moiré (TTSM) warpage metrology system measures warpage of substrates up to 300mm x 310mm (a 300mm wafer or two JEDEC trays).
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