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Details
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Written by Chelsey Drysdale
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Sigma Line module offers a real-time combination of 3D SPI and 3D AOI measurements.
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Details
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Written by Chelsey Drysdale
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FH58M FPC connector is 0.25mm pitch.
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Details
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Written by Chelsey Drysdale
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KY-P3 3D pin inspection now has back-end process AOI capabilities.
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Details
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Written by Mike Buetow
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Indium8.9HF solder paste is halogen-free, no-clean and has an oxidation barrier said to eliminate head-in-pillow and graping.
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