XJTAG v3.6 includes several new productivity and automation-focused enhancements, for setting up tests for complex boards in significantly less time.
Sarcon EGR-11F thermal interface material absorbs a range of unwanted electromagnetic energy.
SQ3000 3D CMM (coordinate measurement) system is powered by multi-reflection suppression (MRS) technology and CyberCMM, new software for coordinate measurement.
YSi-V 12M TypeHS2 hybrid automated optical inspection system succeeds YSi-V 12M TypeHS.
iSpector JDz 520 bench-top inspection system includes 5mp camera, 15µm telecentric lens, co-axial light and 520 x 460mm max. PCB size.