Master Bond EP13LTE features a low coefficient of thermal expansion of 15-20 x 10-6in/in/°C.
UA-3307-B is an edgebond adhesive that enhances board level reliability in automotive and other harsh environment applications.
PF606-P245 lead-free zero halogen solder paste has continuous high-speed printability and a wide reflow process window.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin