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NI-RFmx 2.2 measurement software for PXI RF test systems, when used with second-generation PXI Vector Signal Transceiver (VST), allows testing of 4.5G and 5G RF components such as transceivers and amplifiers using a wide range of carrier aggregation schemes, even as the 5G standard is still being defined.

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REL22 low Ag SAC solder contains bismuth and melts at about 208°C.

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REL61 lead-free solder alloy offers thermal cycling performance for such applications as LED lighting, in-cabin automotive electronics and high power applications. Reliability and performance characteristics equal to or greater than SAC 305 and other low/no-silver solder alloys. Mitigates tin whisker formation. Improves spread, flow and wetting versus low/no-silver alloys. Comes in bar, wire or paste.

AIM Solder

www.aimsolder.com/products/high-reliability-alloys

XPRS  multi-level direct flow inline test handler for assembled PCBs can be tailored based on each product and production process.

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Dragonfly 2020 3D printer is for production of multilayer printed circuit boards and 3D circuitry.

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Quadra 7 high resolution, offline x-ray system features < 0.1µm (100nm) feature recognition up to 10W tube power;

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