Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.
Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.
Identco's VortexID is a wire label system that can place up to 20 labels per minute and operate 24/7.
TRI's TR7600 SV Series 3-D AXI outperforms its predecessor, the TR7600 Series, by a 20% increase in performance.
Bowman's K Series benchtop XRF features an expansive measurement area, selectable spot sizes, and high levels of both precision and speed.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association