Vitronics Soltec's ZEVAm+ selective soldering machine has been redesigned to accommodate board sizes up to 510mm x 510mm (20in. x 20in.).
Krylex's Kura-Low electronics adhesive enables high performance bonding performance at thermal cure temperatures as low as 60◦C, all while being supplied in a highly RT stabilised, one-part, pre-mixed formula.
MRSI Systems' MRSI-705HF high force die bonder is a new variant of the MRSI-705 platform.
Stackpole’s RNCP thin film chip resistor series now features 1210, 2010, and 2512 sizes.
Astronics' ATS-AutoPoint Multi-Axis Robotic System (APMARS) and ATS-AutoPoint Desktop (APDT) automatically diagnose circuit board assembly and component malfunctions.
Rohm's BD5310xG-CZ/BD5410xG-CZ series of Hall ICs are designed for automotive applications requiring magnetic detection.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association