Rohm Semiconductor's R60xxRNx series is an addition to its PrestoMOS lineup of 600V Super Junction MOSFETs.
Master Bond's Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy formulated to serve as the damming compound in dam-and-fill encapsulation applications.
TRI's TR7700QH SII ultra-high-speed 3-D AOI solution features 15µm high resolution, 21 MP imaging, and large FOV inspection.
ViTrox's V-One 4.1.0 Beta Version comes with added features and enhancements to empower users with data insights and analysis capabilities.
Parker's Therm-A-Gap Gel 60HF high-flow thermal gel provides flow rates of up to 100g/min and is designed for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units and sensors, and computing components such as CPUs and GPUs.
Shenzhen Deepmaterial Technologies' latest range of advanced adhesive solutions includes its One Part Epoxy Adhesive, Two Part Epoxy Adhesive, and Magnet Bonding Adhesive.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association