Indium8.9HFRV is an air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys.
Rohm Semiconductor's GNP1070TC-Z and GNP1150TCA-Z are 650V GaN (Gallium Nitride) HEMTs optimized for a wide range of power supply systems applications.
Emil Otto's two new cleaners have been specially developed for the cleaning of conductive surfaces and floors, especially for the ESD area.
Henkel's Loctite Ablestik ABP 8068TI is an ultra-high thermal conductivity pressure-less sintering die attach adhesive that meets automotive grade reliability standards.
Master Bond's EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association