Hirose's BM56 Series multi-RF board-to-board connector provides a size reduction of up to 71% compared to conventional designs.
Yincae's UF 120HA material is designed to provide a fast flow, lower-temperature cure for high-throughput application.
Vishay Intertechnology's four new series of 200V FRED Pt ultrafast rectifiers are provide space-saving, high efficiency solutions for commercial, industrial, and automotive applications. The 1A VS-1EAH02xM3, 2A VS-2EAH02xM3, 3A VS-3EAH02xM3, and 5A VS-5EAH02xM3 are each available in Vishay Automotive Grade, AEC-Q101 qualified versions.
Kurtz Ersa's Auto Scavenger Module is an extension for the Ersa HR 600 XL rework platform that is designed to enhance the efficiency and effectiveness of non-contact removal of residual solder from circuit boards.
Hernon Manufacturing's Ultrabond Sealant 721 is a UV curable adhesive designed to deliver exceptional sealing capabilities for a wide range of plastics.
Mek's VeriSpector Inline is an inline THT AOI system designed for inspecting THT components before they enter wave or selective soldering machines to enhance inspection efficiency and accuracy in through-hole assembly processes.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association