Indium's Indalloy 303 is a bismuth-based alloy developed for low-temperature reflow processes.
TRI's TR7700 SIII Ultra CI can detect coating issues, measure coating thickness, and inspect dispensed flux and glue.
Engineered Materials' custom pressure sensitive adhesive tape parts are designed for many applications in the electronics industry.
Rohm Semiconductor's 4ch/6ch LED driver ICs are designed for medium- to large-size automotive displays in car infotainment and instrument clusters.
MacDermid Alpha's Argomax 2148 paste silver sintering technology is specifically developed for sintering large packages or components on gold or silver substrates.
Aegis Software's "Lean Material Management Anywhere" is a comprehensive manufacturing material management suite that features many key material management functions within a single web-based environment.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association