TechnoDigm's All-In-One LED UV Curing System now includes an optional integrated UV sensor.
BuGang's M/C Nozzle Cleaner series offers simultaneous cleaning of up to 24 nozzles at a speed of 12 seconds per nozzle.
AIM Solder's H10 is a halogen-free no clean solder paste capable of transfer efficiency greater than 90% on area ratios of 0.50 and a stencil life of more than 8 hours.
Rohm Semiconductor's BD7xxL05G-C series of primary LDO regulators features a rated input voltage of 45V and 50mA output current optimized for redundant power supplies.
Heraeus Electronics' Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste is a high reliability, high performance solder paste that provides a competitive TCO offering.
Shenmao's PF735-PQ10-10L is a low melting point lead-free solder paste that has been designed for the SMT process and is meant to increase production capacity in the high-speed printing process.
Press Releases
- ViTrox Americas Doubles Capacity at Demo Center in Hutto, Texas
- Absolute EMS Earns ITAR Registration, Strengthening Manufacturing Capabilities for Military and Defense OEM Customers
- The ICAPE Group Announces the Launch of Its E-Shop at Electronica
- ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology