Molex's KickStart is an OCP-compliant connector system that combines low-speed and high-speed signals, as well as power circuits, into a single cable assembly.
Shenmao's PF606-P276 is an ultra-low void no-clean zero-halogen lead-free solder paste.
BTU International Aurora 200N convection reflow oven has closed-loop convection control, and 200" of heat to support faster line speeds up to 25% faster than those supported by Aurora 150N.
Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.
Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.
Press Releases
- Robert C. Donovan Joins DISTRON CORPORATION, Marking the Third Generation in Family Leadership
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments