Yamaha Robotics' VP-01G-Y solder paste inspection system uses advanced algorithms in 2-D and 3-D modes to aid focusing and contour extraction.

Analysis includes 3-D solder-paste and adhesive inspection, foreign-matter detection and board warpage to assist screen-printing, dispensing, and component-placement processes. Compensates for board warping and handles inspection of flexible PCBs, and advanced features include a ring light source that provides 360° illumination to ensure reliable inspection and accurate three-dimensional measurements. Features one-head design to allow continuous, changeover-free inspection, with 25µm, 20µm, or 15µm lens and software-controlled multiple-resolution switching for additional settings. Resolution is switchable for each visual field, enabling optimum throughput when inspecting boards with areas of high interconnect density and mixed-size parts including ultra-small components down to 0201 and 03015 SMD chips. Features board-size range from 50mm x 50mm to 510mm x 510mm to fulfil production demands across sectors including automotive, medical, industrial and consumer electronics manufacturing.

Yamaha Robotics

yamaha-motor-robotics.eu

• Prev
• Next