Auto Slice & View 4.0 three-dimensional (3D) reconstruction software makes 3D imaging faster, easier, more accurate and cost-effective. Enables 3D structure and composition of samples at the nanometer scale. Works with all FEI DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms. Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), to ensure no information is lost in sectioning of sample. Modifies automated procedures on-the-fly, with ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to permit long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain high spatial resolution over sections larger than a single field of view. New algorithms help to ensure uniform thickness of slices and precise and reproducible placement of each cut, for higher accuracy. Redesigned interface optimizes user guidance and ensures critical information is presented, if needed. Prompted workflow approach streamlines setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.

FEI, fei.com/software/auto-slice-and-view

JT 2127-Flex hardware adapters are for testing of a variety of DIMM and SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software. Are said to provide pin-point diagnostics from a known-good test interface to assess whether the socket is soldered correctly. Modular system comprises two basic elements: 1) a high-speed multi-channel IO module – JT 2127/DMU, and 2) a personality adapter for the chosen DIMM type – JT 2127-Flex xxx. The combination permits test signals to be sent to and from the boundary-scan source device on the UUT performing a thorough check for open pins and short circuits. In addition the voltages on the power pins of the DIMM socket are also measured. Currently supported DIMM types are xxx = 204-3, 244-mi3, 260-4 & 288-4. Other DIMM formats can be supported upon request.

JTAG Technologies, jtag.com

BF-3Di-L1 3D AOI provides measurement of components with a height range from 0-20mm, achieving 1µm height resolution. Is reportedly 50% faster than Saki’s previous 3D machine. Camera and lighting systems capture clear, detailed images with no shadowing for inspection of lifted leads, tombstones, reversed polarity, and height variations. Is available for XXL sizes, in dual-lane configurations, or with optional side-angle cameras.

Saki Shanghai Co., www.sakicorp.com   

J8 no-clean solder paste is for use with a variety of jetting paste equipment. Provides consistent solder deposits as small as 200μm. Is fully compatible with all AIM no-clean solder pastes for use in applications where jetted paste deposits are combined with printed paste deposits. Novel activator system provides durable wetting action, accommodating a range of profiles and producing bright, shiny joints without graping. Reduces voiding to as low as <5% on BGA and <10% on BTC ground pads.

AIM Solder, aimsolder.com