NXT-H provides wafer, tray part, and reel part placement. High rigidity construction with linear motor movement and high-res cameras. Combines placing pressure, high accuracy and high quality using advanced control technology. HEPA filter provides a cleanroom class of 1000; XY robot is cleanroom capable. Is equipped with a 15" touchscreen panel and graphical interface. PCB load time is 4.3 sec. Accommodates printed circuit boards 48 x 48mm to 610 x 380mm.
VersaFlex-Ultra selective solder module features two solder pots, either y- and x-variable or z-variable, equipped with different solder and different solder nozzles.
X7056-II inline automatic 3D X-ray inspection machine features a new handling concept called xFastFlow for printed circuit boards change in as few as 4 sec.
E-Z Step stepped stencils are used to facilitate an increase or decrease of paste volume and deposit height on selected printed circuit board areas with mixed component technology, large ground pads, intrusive reflow or coplanarity issues. Step areas are 20 to 150µm with support of complex shapes. Step ramp is in 50µm increments. Positional accuracy is <10µm on step areas. Material thickness is +/-2%.
MET Stencil
www.metstencil.com
Press Releases
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