MC7885-UFS flip-chip underfill has a Tg of >240°C and stress-absorbing capabilities. Underfills large-area flip-chip components and reportedly cures without voids and internal stresses. For use in chip-on-board underfill and standard flip-chip underfill component applications. Reportedly withstands temperatures up to 350°C without thermal degradation. Cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus. Most curing can be done at 120°C; can increase temp. to 150°C.

AI Technology, www.aitechnology.com

Genealogy software module is capable of tracking, tracing and controlling printed circuit boards throughout assembly to the finished product. Captures the identity of each individual PCBA, subassembly or other item, and links information directly to the serial number of the finished product. Enables drill-down to multiple levels of subassembly, identifying which component lot numbers were used to build a specific PCBA in a specific product serial number. Traceability database is backwards-searchable to identify which product serial numbers were built using a specific component lot number. Permits multi-level box build traceability and improves inventory control with real-time visibility of all materials in process (WIP). Is said to reduce manufacturing, warranty and customer service costs, and improve product quality with automated quality control.

Cogiscan, www.cogiscan.com

SI 7.47 software release has improved downlink function for solder paste inspection (SPI), automated AOI assurance, and includes new µBGA analysis, among other features. Has closed-loop interfaces to MPM and Panasonic printers and extended connections to DEK and Ekra printers. Now supports print process without barcodes. Integrated Verification facilitates simple assurance of AOI inspection program quality by automatically saving all defect images acquired at the verification station and making them available for future optimization or generation of new inspection plans. Extends µBGA inspection by an analysis with features combination that conjoins and evaluates completely different features. New converter changes all relevant parameters of the inspection pattern automatically, at the press of a button. 

Viscom, www.viscom.com

Solder saver is for use with SnPb and Pb-free wave soldering machines. Design changes include a separate activation switch; user can hold it in one hand and activate it with the other. Has an adjustable handle to reach solder pots in wave soldering machines. Can recycle dross; scoops hot dross from surface of the wave solder pot. Dross oxides are separated from the solder by high-speed rotary process system. Works on a continuous process basis.

Aprotec Instrumentation, aprotecinstrumentation.co.uk