Paraquda 2 combines solder paste jetting and SMD assembly. Reportedly provides changeover without downtime, component management, and the integration of jet printing of solder paste or glue. Solder jet printer has speeds up to 80,000 dots/hr., is 51µm @3σ, and is suitable for 0201 components. Solder paste jet valve can be installed on existing machines, such as the Scorpion high-speed jet dispenser or the Paraquda component placer.  Production is fully automated. Solder paste application and component placement are integrated.

Essemtec, www.essemtec.com

Fischerscope X-ray XDLM237 combines high-intensity beam of a micro-focus tube with a small aperture and large detector window. Advantages include non-destructive measurements without damage to tools; fast measurement times; measurement spot of 50μm. Layer thickness reportedly can be measured on the finest cutting edges of high-end tools. Can determine base tools’ metallic composition. Has programmable XY-stage and Z-axis for automated measurements.

Fischer Technology, www.fischer-technology.com  

FlexTRAK-S plasma system has large capacity plasma chamber for semiconductor and electronics packaging. Integrates with a variety of process equipment.  Has 5.5l plasma chamber and high-power RF generator. Is configurable and has high-throughput. Universal architecture remains the same if elongated. Accommodates substrates and material handling configurations to support a variable-size form factors, including boats, carriers, Jedec/Auer boats, strips, and laminates. Can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, reel-to-reel, and as a standalone for island-based production environments. Width is 382mm. Service components are accessed from the front. Can be configured to apply three different modes of plasma treatment: direct, downstream, and ion-free. Smart Tune management system provides closed-loop plasma control; optimizes RF system and minimizes tuning time. Automatically recycles to a plasma-ready state.

Nordson March,  www.nordsonmarch.com

Sigma X 3D inline solder paste inspection machine features dual-laser technology to eliminate shadowing; application bandwidth that is compatible with all PCB colors and finishes, including HASL; measurement height range of  +/- 1mm (0.040”) standard and optional  +/- 2mm (0.080″); and identification features including via holes, edge of board and routing to reduce false calls. Industry’s best PCB warp-management system with real-time Z axis that tracks to the PCB surface. Novel jet defect repair  adds paste to pads with insufficient deposits, eliminating rework and board scrap. Accommodates PCBs up to 580 x 510mm (23″ x 20″). Height repeatability: 3 Sigma <1µm. Volume repeatability: 3 Sigma <1%. Height accuracy: 2µm. Paste size 100 x 100 µm minumum; 20 x 20mm maximum.

Parmi, http://parmi.com/spi-application-products-overview/sigma-x/http://parmi.com/spi-application-products-overview/sigma-x/