Macaos Enterprise v. 4.0 PCB management, panelization, stencil creation and online ordering software includes assembly data manager for adding or modifying pick-and-place data, bill of materials data, and graphical remarks for PCB. Expands support for sending an RFQ to EMS providers. Enhanced stencil creation module offers greater flexibility in the placement of data within the stencil frame, additional options for splitting a large opening into smaller openings or
changing the shape of an opening, and improved support for stencil creation scripts. Additional annotations have been added to panel drawings to show X and Y step distance and size and shape of all fiducials and bad marks. Now supports boards with up to 30 copper layers, Gerber files in the X2 format, and improved support for ODB++ files.
Macaos Software, www.macaos.com
Squink prints conductive ink and places components on circuit boards. Prints and assembles parts on flexible or rigid substrates. Is for prototyping. Allows design sharing and locates schematics online. Can access through USB, Ethernet cable, or Wifi. Accepts Gerber and .png files.
BotFactory, https://www.kickstarter.com/projects/botfactory/squink-the-personal-electronic-circuit-factory
Nu/Clean 800 X2L inline cleaner has a dual tank system. Runs an independent chemical wash with chemistry of choice, an independent DI water wash, or a full chemical wash with a full DI water wash. Both tanks heated independently. Parameters controlled via touch-screen software. Dedicated, recirculating isolation rinse prevents cross contamination from chemistry wash tank to water-only wash tank. Every liquid is either recirculated or sent to an evaporator via closed-loop sump system for zero discharge disposal. Chemical wash tank drains to sump tank and then to evaporator, which separates water from residues. Water-only wash tank is recirculated through a DI water system to remove contaminants and returned to water-only wash tank. Isolation rinse is closed loop with dedicated DI System. Final rinse tank cascades into rinse tank. Water from rinse tank is sent to a second DI system to be cleaned and returned to final rinse.
Technical Devices Co., www.technicaldev.com
SHP-K & SHP-KM soldering iron handpiece can be used in OKI/Metcal soldering systems, designated PS-800, PS-900, MFR-PS1100, and MFR-PS2200. SHP-K is compatible with connector on PS-800/900 systems; SHP-KM is compatible with connector on MFR-PS1100/PS2200 systems. Permit use of EasyBraid EK series cartridges that do not need heating elements necessary with OKI/Metcal design.
EasyBraid, www.EasyBraidco.com
SMT 88UH reportedly can be underfilled at room temperature without preheating substrate. Advantages reportedly include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be stored in a regular refrigerator or freezer. Can be used for chip-scale packaging, ball grid array devices, package-on-package, land grid array, and certain flip-chip applications. Suitable for bare chip protection in memory cards, chip carriers, hybrid circuits and multichip modules.
Yincae Advanced Materials, http://yincae.com/board-level-assembly.html
Loctite Eccobond NCP 5209 nonconductive paste is designed for fine-pitch flip-chips. Delivers underfill protection. Is pre-applied onto substrate, facilitating bump protection and interconnection. Formulated for Cu pillar bumps and Cu OSP substrate pad finishes, it reportedly offers bump reinforcement and safeguarding for devices with pitches of less than 100µm and gaps less than 40µm. Has stage life up to 2 hr. at 70°C. Passed MSL3 testing. Withstands up to 1,000 thermal cycles. Is capable of high-temperature storage of up to 1,000 hr. at 150°C.
Henkel Electronics Group, www.henkel.com/electronics