SPR paste retainer reportedly improves the management of solder paste within the printing area. Helps eliminate leakage of solder paste out of the print area by way of a floating spring-supported paste retainer attached to the end of the squeegee holder. Applies constant pressure downward; glides along stencil surface.
Transition Automation, www.transitionautomation.com
SMT256/SMT266 chip assembly and ball attachment encapsulants can be dipped, printed, jetted or brushed at temperatures ranging from 140° to 260°C. Are said to enhance solder joint reliability and eliminate solder joint cracking in microchip applications, reportedly creating a solder joint bond five to 10X stronger than a conventional solder joint. For use in Pb-free, SnPb and SnBi processes. Reworkable.
Yincae Advanced Materials, www.yincae.com
Electrovert Electra wave soldering system features novel IsoThermal convection preheat. Full nitrogen tunnel can be field-upgraded with patented flux control. Integrated fume extraction. Has 24" (610mm) process width capability, dual head ServoJet fluxing, and DwellMax Plus solder nozzles. Features 100% accessibility, for ease of maintenance.
Speedline Technologies, www.speedlinetech.com
ACE inline fluxer and preheating unit is an intelligent, dual-purpose system said to reduce process time by concurrently applying flux to the specific components to be soldered, then preheating the board in preparation for soldering while the board previously fluxed is being soldered by any KISS inline selective soldering system. Applies a range of flux types with either an atomizing flux applicator for rapid application or a precision drop-jet applicator for no-clean processing. Reportedly handles low pH fluxes down to 2.0 as well as fluxes with solids content as high as 35%. Can be equipped with either an atomizing or drop-jet applicator, or alternatively it can be equipped with dual atomizing and drop-jet flux applicators for greater flexibility. Configurable with either convection or IR preheat to provide a controlled ramp without inducing thermal stress upon components while maintaining a uniform temperature gradient and stable topside board temperature. Preheating system is closed-loop controlled.
ACE Production Technologies, www.ace-protech.com
Mini Vario Wave selective soldering system combines a selective solder machine with a wave soldering process.
Press Releases
- Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
- OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf