Circuits Assembly Online Magazine - Features

Step stencils now come in novel NiCut version said to have the quality of electroform stencil but with faster turn-around time. Offer flexibility for achieving proper solder paste height and volume. Feature smooth squeegee side stencil surface, uniform step thickness, NiCut trapezoidal aperture, and paste transfer. Suitable for fine-pitch components including BGAs, QFNs and resistor networks.

Photo Stencil, www.photostencil.com

RS Metrics creates analysis reports of key performance indicators that go beyond the standard set of OEE measurements of availability, performance and quality. Provides user-friendly way to view real-time WIP tracking, better manage materials and improve production control. Is entirely customizable and enables paperless functionalities. Enhances Lean manufacturing and value steam mapping of a factory floor.

Factivity, www.factivity.com

TNV25-508EMII-P convection reflow oven features a new flux collection system, an 8 degree per sec. cooling capability, and reduced nitrogen consumption (equal to or less than 500ppm: 100NL/min; equal or less to 200ppm: 180NL/min). Is 4996 x 1368 x 1690mm. Handles boards up to 250mm (width) x 330mm (length).

Tamura Systems, www.tfz-tamura.com

Auto-Dip systems feature touch-screen controlled models with programmable preheat and dip height settings and an adjustable, finger-type printed circuit board holder that grips the edges of the board throughout the soldering cycle. Is useful for heavy component-laden assemblies; can accept customized pallets of small, irregularly-shaped PCBs. An interchangeable version of the pin-type PCB holder is included; permits simultaneous soldering of multiple PCBs, randomly placed on the fixture-less bed-of-nails loading platform. Have titanium solder pots with high-precision temperature controllers for use with Pb-free SAC or SnPb solders. Include automatic dross skimmer and collection trough and startup timer. Largest model can handle PCBs up to 600 x 350mm; has a 100kg solder pot. EZ-Flux 500A spray fluxing system included. For short-run batch applications.

Manncorp, http://www.manncorp.com/Auto-Dip.html

MicReD industrial power tester 1500A combines power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics. For power cycling and thermal testing of electronics components to simulate and measure lifetime performance. Tests components without removing them from the test environment. Analyzes thermally-induced mechanical failures such as die-attach wire bond separations, die and package stack-up delamination and cracks, and solder fatigue. Is based on T3Ster advanced thermal tester platform. Performs power cycling tests of metal-oxide semiconductor field-effect transistors (MOSFETs), insulated-gate bipolar transistors (IGBTs) and power diodes. Has user-friendly touch-screen interface. Record range of information during test, such as current, voltage and die temperature sensing; and detailed structure function analysis to record changes in the package’s thermal structure.

Mentor Graphics, www.mentor.com

VHX-5000 digital microscope instantly captures any area in complete focus, without the user adjusting focus. Provides high-resolution, large depth-of-field imaging and integrated 2D/3D measurement, without specialized training. Comes with CMOS camera capable of imaging at 50 frames per second. Automatically scans throughout the focal range and generates an image in focus. Enhances contrast and reduces over/under saturated areas on a target. Software describes implementation of each function of the VHX. Magnification range 0.1x - 5000x. Supports bright and dark field, transmitted, polarized, and differential interference observation.

Keyence, www.keyence.com