Supreme 3HTND-2DA is a fast-curing, one-component epoxy system formulated for die attach applications. Cures in 5 to 10 min. at 150°C and reportedly has unlimited working life at room temp. Is available in syringes and has a shelf life of six months when stored at 40 to 50°F. Has a die shear strength of 19-21kg-f. Has excellent adhesion to metals, ceramics and silicon dies. Is serviceable over a temp. range of -100°F to +400°F. Has the ability to withstand rigorous thermal cycling and shock. Passes NASA low outgassing test specifications. Has low ionics, particularly chlorine (<15 ppm). Features dimensional stability, superior thermal conductivity, electrical insulation properties and a glass transition temp. of 100-105°C. Is not premixed and frozen; requires refrigeration. Is suited for automatic dispensing equipment. Has a viscosity of more than 300,000cps (thixotropic).
Master Bond, www.masterbond.com
EF-8800HF wave solder flux is designed for thick, high-density PCBs. Is halogen-free, mid solids, alcohol-based, and no-clean. Is said to demonstrate superior hole fill, pin testing and solder ball performance. Spreads evenly. Tack-free residue. Was developed for spray fluxing applications, for standard and low Ag SAC alloys, and handles long exposure to higher preheat and solder pot temperatures.
Alpha, www.alpha.alent.com
MD-X Series hybrid laser marker has 3-axis control and auto-focus capability. Built-in 2D code reader combines combines attributes of YVO4 and Fiber laser makers. Built-in camera performs automatic focusing without use of external devices. This is possible even when targets may not be placed at the exact same focal length from the laser and eliminating the need for external tooling. Has IP64 enclosure rating on marking head.
Keyence, https://www.keyence.com/PRMDX
Icarus (Image Comparison Algorithms for Radiography Unified Software) reportedly locates microscopic differences in the shape, size, and location of features, like broken or bent wire bonds.
Creative Electron, http://creativeelectron.com/
FailSim simulates defects to provide real-world test coverage on a live board. Identifies program, debug or fixture issues that could be reducing fault coverage. Verifies that an existing ICT test detects failures on an UUT by simulating component defects (wrong value) by using HW simulation, by placing additional resistors/capacitors in parallel/series to the DUT (device under test) while checking that the actual test statement detects the failure condition.
Digitaltest, www.digitaltest.net/page
Cion-LX module/FXT96 boundary scan module is for test of analog, digital and mixed signals. Allows extension of boundary scan test to non-scannable circuit components such as connectors, clusters or analog interfaces. Ninety-six single-ended, 12 high current and 24 differential channels are available. Each channel is bidirectional and can be programmed using different parameters. Is based on ASIC Cion-LX, a JTAG controllable mixed signal tester-on-chip. Can be connected to any TAP and can be cascaded to increase the number of channels. Can be operated in combination with other Cion or ChipVORX modules. IEEE1149.1, IEEE1149.6 and IEEE1149.8.1 standards are supported.
Goepel Electronic, www.goepel.com