MY600 jet printer has 50% higher throughput, reportedly reaching speeds of 1.1 million dots per hour. Handles flexible substrates, board cavities, package-on-package, QFNs and new components with small process windows. Controls dot volume, diameter and deposit repeatability. Adjusts solder paste volume and shape for each individual pad on the printed circuit board. Is entirely software-based, and can be programmed stand-alone or connected to certain pick-and-place machines.

Micronic Mydata AB, www.mydata.com

KISS-103ILDP dual pot inline selective soldering system concurrently solders two printed circuit boards using two solder pots, each equipped with an X-Y-Z axis positioning system. SMEMA compatible. Solders PCBs up to 18" x 24". Can be configured with novel inline fluxer and preheating unit. Permits SnPb and Pb-free solder pots to reside within the same machine. Both solder pots can be equipped with a dual-solder nozzle pump assembly that permits four different solder nozzle shapes.

ACE Production Technologies, www.ace-protech.com

RS-600 six zone air and nitrogen reflow ovens offer the same features as the larger 8- and 10-zone ovens, such as a top and bottom Independent air velocity controlling system and a four-way air recycling system in each zone. The six zone oven has a total heated length similar to ovens that are 7-, 8-, and 9-zones. KIC AFP (auto-focus power) is now a standard feature on reflow ovens.

Juki Automation Systems, www.jukiamericas.com

MPM Momentum BTB (back-to-back) printer is 200mm shorter than the standard Momentum, with an overall length of 2.8m for the two machines. Is configured for back-to-back processing; enables dual-lane processing with the combined output of two machines. Is designed with all-front access to electrical system, solvent reservoirs, etc. Wet Print accuracy is 20µm@6ó, Cpk ≥ 2.

Speedline Technologies,  www.speedlinetech.com