Bi rework solder paste is designed for desoldering Pb-free components and for LED removal. Reduces risk of board damage during desoldering. With desoldering temp. of 180°C, it reduces desoldering temperatures and times. Is a no-clean, halide-free flux. Features easy dispensing and cleanup. Provides excellent removal of through-hole and SMT components. Is RoHS compliant.
The Balver Zinn Group, www.balverzinn.com
BP 256 solder joint encapsulant is for BGA, CSP, flip-chip, PoP, and other ball bumping applications. Is said to create a solder joint bond five to 10 times stronger than a conventional solder joint, enhancing reliability and eliminating cracking. For use in lead-free, SnPb and SnBi processes. Reworkable.
Yincae, http://www.yincae.com/technical-information.html
iFlex T2 surface mount machine can place component heights up to 21mm. Includes tray and tube feeding capability. Is designed for high mix environments. Reportedly achieves first-pass yield production levels with defect levels of less than 1dpm.
Assembléon, www.assembleon.com
Quad 01005 ceramic nozzles enable placement for 0201 and 01005 micro-components. Measure 0.32mm OD with a 1mm ID.
Count On Tools, www.cotinc.com
Optymo 4.2 software is intended to help with design choices, component management, purchasing and inventory management. Reportedly simplifies workflow between design and operations. Offers three packages: Optymo Design, Optymo Essentials, and Optymo Advanced. Includes graphical exploration based on basic components; revision control for components; copy/paste function within and between applications; online help and application notes, and an export module of configurable data. Offers a tree view of component categories and subcategories.
Inlynk, www.inlynksoft.com
WR5000M, WR3000TS, WR3000SS, WR3000TA and WR3000SA rework systems offer application flexibility, productivity and process control, including 400W of power over three independently-controlled channels, up to 21 tool options, up to 200W of soldering power and hot air power, and up to 120W of desoldering power for ground plane and multilayer boards. Comes with all critical components and tips. Less than 5 sec. hot air time to temperature. No end of cycle hot air cool-down time. Tool air flow volume of 1-15 L/min. Rotary vane vacuum pump. PC connectivity and data logging capabilities. Temperature stability of ± 2°C / ± 4°F. ESD-safe, meets or exceeds MIL-STD and J-STD-001E industry specifications.
Weller, Apex Tool Group, www.weller-tools.com
Press Releases
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less