XQuik combines x-ray imaging with AccuCount Technology image processing and inventory management to provide accurate counts of components stored in tape-and-reel. Is said to automatically completes the count of components as small as 01005 with better than 99% accuracy in seconds. Works without having to remove reels from moisture barrier or anti-static bags. Benchtop system with a footprint of 26 x 24" (66 x 62cm). Barcode reading, automatic label printing and MES system interface options available.

VJ Electronix, http://vjt.com/vje/vje/

TrueHeight Spacer Blocks non-collapse disc spacers are said to improve yields of assemblies with large BGA devices. Enables reflow soldering of some types of through-hole devices. Are said to mitigate corner solder bridging caused by BGA warping during SMT reflow. Come in tape-and-reel packaging for automatic placement. Aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components by raising the component off the PCB, permitting solder to reflow freely to achieve 100% hole fill.  Height control + 0.010mm.

Alpha, www.alpha.alent.com

Bi rework solder paste is designed for desoldering Pb-free components and for LED removal. Reduces risk of board damage during desoldering. With desoldering temp. of 180°C, it reduces desoldering temperatures and times. Is a no-clean, halide-free flux. Features easy dispensing and cleanup. Provides excellent removal of through-hole and SMT components. Is RoHS compliant.

The Balver Zinn Group, www.balverzinn.com

BP 256 solder joint encapsulant is for BGA, CSP, flip-chip, PoP, and other ball bumping applications. Is said to create a solder joint bond five to 10 times stronger than a conventional solder joint, enhancing reliability and eliminating cracking. For use in lead-free, SnPb and SnBi processes. Reworkable.

Yincae, http://www.yincae.com/technical-information.html