GLRS laser singulation system is configurable with a near IR laser (1032nm) for use with metal-core substrates or a green laser (532 nm) for use with ultra-thin and flexible substrates. Inert gas injection at the Laser point minimizes local oxidation concerns, Particle/Gaseous remediation is affected from beneath. Vacuum is provided via two 5HP blowers and a three-stage filtration system capable of handling particles as small as 20 microns.
Getech, www.getechsys.com
LineMaster DM inspection machine has dual mode capability; incorporates SPI and AOI. Validates overall variables associated with component placement and solder paste printing. Detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and accurate and repeatable 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, offline CAD/Gerber programming and a defect repair station.
ASC International, www.ascinternational.com
MC-301 benchtop reflow oven is for prototyping, manufacturability testing, and short-run batch production. Has an Android-based control app; permits surface mount assemblers and product developers to meet specifications for preheat, soak, reflow, and cooling phases. Heating and cooling rates in each stage are automatically calculated. Includes internal thermocouple to measure and record actual temperatures on the printed circuit board while soldering. Real-time feedback from the thermocouple can be used to control heater power and to establish temperature settings. Heating chamber is divided into multiple heating zones; each one is assigned to its own channel of the temperature control system. Ensures delta-T ±2 °C across 10" x 8" working area. Rapid cooldown is achieved with intake fans that draw air through the bottom of the unit and out through the 3" exhaust port. Measures 27" x 19" x 11" and weighs fewer than 100 lbs.
Manncorp, www.manncorp.com
Scope-Line MX 2.5D x-ray and analysis system features closed microfocus tubes and durable detectors and AOI/AXI/SPI repair station. Generates semiautomatic test programs. Comes with six-axis system for 70° angle view and 360° rotation of device-under-test. Includes topoVIEW visualization tool and test functions for automatic evaluation of BGAs and other solder joints.
Goepel, www.goepel.com
Scienscope, www.scienscope.com
ValveMate 9000 precision valve controller features microprocessor circuitry to ensure dispensing of precise, accurate, and repeatable amounts of adhesives, lubricants and other assembly fluids. Auto-Increment mode adjusts dispensing parameters after a certain number of shots or a specific elapsed time.Features include independent dual-valve control programming, each with 24W temperature controllers for J-type thermocouples. Each channel drives a remote high-speed solenoid valve up to 500Hz. "Spike-and-hold" function permits the controller to spike the voltage for a user-specified spike time and then throttle the voltage down to a user-specified hold voltage after spike time expires. Electronic pressure regulators provide stability in the fluid reservoir by maintaining consistent dispensing with full-to-empty pressure control. Remotely parameter setup.
Nordson EFD, www.nordson.com
BiAgX high-melting Pb-free solder paste is designed as a drop-in replacement for lead-containing solder pastes. Has passed MSL1 and thermal cycle testing. Works in environments in excess of 150°C; requires minimal process adjustments. Is Sb-free and does not contain specialty materials such as nanosilver or sintering aids. Comes in dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium, www.indium.com/BiAgX